Monthly Archives: February 2014

BGA Assembly Basics

BGA (ball grid array) is a type of microelectronics packaging used in integrated circuits. The surface mount BGAs are small solder balls that are aligned in a grid, mounted permanently on the circuits in the PCB assembly process. The balls

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How To Avoid PCB Corrosion

Printed circuit boards are susceptible to corrosion both from environmental moisture and the voltage that passes through the pins. There are multiple ways to protect an assembled PCB from falling prey to the damage that can be caused from every

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